Herzlich Willkommen beim beam-Verlag in Marburg, dem Fachverlag für anspruchsvolle Elektronik-Literatur.


Wir freuen uns, Sie auf unserem ePaper-Kiosk begrüßen zu können.

Aufrufe
vor 5 Jahren

1-2012

  • Text
  • Bild
  • Microwave
  • Mischer
  • Wireless
  • Schwarz
  • Phasenrauschen
  • Measurement
  • Output
  • Messungen
  • Software
  • Mikrowellentechnik
HF-Praxis 1/2012

Test & Measurement

Test & Measurement National Instruments expands NI CompactDAQ Platform with Single-Slot Chassis National Instruments announced new 1-slot NI CompactDAQ chassis that support wireless, USB and Ethernet buses, giving engineers and scientists the portability of a data logger with the performance and flexibility of modular measurements. The NI cDAQ-9191, cDAQ-9181 and cDAQ-9171 chassis support all NI C Series modules for the NI CompactDAQ platform and can be used in conjunction with the existing 4- and 8-slot chassis. With modules designed for almost any sensor, the NI CompactDAQ platform eliminates the fixed functionality of traditional sensor measurement systems and gives engineers and scientists the ability to increase productivity while decreasing overall cost. New metal enclosures make the chassis more resistant to environmental damage as compared to the previous plastic sleeves. The chassis operate in a temperature range of 0 to 55 degrees Celsius and can withstand up to 30 g shock and 3 g vibration, making NI CompactDAQ 1-slot chassis ideal for demanding test applications on the benchtop, in the field or on the production line. More than 50 measurement-specific modules featuring multiple electrical and sensor connectivity options can be combined with any chassis to create customized systems specific to the needs of numerous applications. NI Signal Streaming technology delivers high-bandwidth capabilities that make it possible to achieve sustained high-speed and bidirectional data streams over USB, Ethernet and wireless buses. Zero configuration networking technology simplifies initial setup, eliminating the need for IT involvement in network setup and integration. NI-DAQmx driver software, included with each NI CompactDAQ chassis, goes beyond a basic device driver to deliver increased productivity and performance. With NI-DAQmx, engineers and scientists can log data for simple experiments or develop a complete test system in NI LabVIEW, NI Lab- Windows/CVI, ANSI C/C++ or Microsoft Visual Studio .NET. A consistent API means that an application developed for an NI CompactDAQ wireless chassis will work with an NI Compact- DAQ USB or Ethernet chassis without any modifications to the software. In addition, all new NI CompactDAQ chassis now support the new controller area network (CAN) C Series module for optimal communication across various networks. ■ NI, www.ni.com Tektronix unveils Solution for MIPI Alliance M-PHYSM Testing Tektronix, Inc., announced the industry‘s most cost-effective and only customer-proven solution for the MIPI Alliance M-PHY testing based on the newly-ratified M-PHY v1.0 specification. Building on the industry‘s first M-PHY test offering introduced last September, Tektronix now offers mobile device hardware engineers a simple, integrated solution for M-PHY Transmitter and Receiver debug, validation and conformance testing needs. The Tektronix solution is simple and requires only a Tektronix DPO/DSA/MSO70000 series oscilloscope and an AWG7000 Series arbitrary waveform generator. Developed in close cooperation with Synopsys and ST- Ericsson, the Tektronix „2-box“ solution provides scope-integrated error detection for receiver tolerance testing and re-usability with a single set-up for both the M-PHY and lower-speed D-PHYSM specifications. M-PHY is a high-speed serial interface to the DigRF v4, UniPro, LLI, CSI-3 and DSI-2 interconnect standards of the MIPI Alliance and will be used in the development of mobile devices that offer increased performance, effective power management schemes, robustness against RF interferences and low RF emission. The Tektronix „2-box“ solution covers both Transmitter and Receiver tests, including comprehensive high-speed tests, Error-Detection, Pulse Width Modulation signaling, PSD (Power Spectral Density) measurements, and DigRF verification. This solution significantly reduces equipment cost compared to alternatives from other vendors. The ability to perform PSD measurements on an oscilloscope is a patent pending capability exclusive to Tektronix. A new setup library and MOIs for Receiver Tolerance with Bit Error Rate testing is also available for verifying M-PHY Receivers. The DPO/DSA/MSO70000 Digital and Mixed Signal oscilloscopes provide the most accurate real-time performance on the market with 100 GS/s sampling rate performance for lower noise and increased data points on 3x oversampled 33 GHz acquisitions. The AWG7000 Series Arbitrary Waveform Generators, with up to 24 GS/s and 10 bit vertical resolution, deliver the accuracy, performance and flexibility required for the full range of M-PHY debug and verification testing. ■ Tektronix www.tektronix.com 40 hf-praxis 1/2012

RF & Wireless Test & Measurement Teseq‘s new Power Amplifier delivers Reliability and Consistency GaAs IC technology improves compression Teseq expanded its broadband amplifier line to include a new Class A model that operates from 10 kHz to 400 MHz with a saturated power level of 110 W. The CBA 400M-110 uses gallium arsenide integrated circuit technology to provide markedly better compression characteristics and increased efficiency than comparable silicon-based power amplifiers. The new power amplifier is designed for demanding EMC testing environments with non-ideal load conditions due to mismatch caused by the coupling device or equipment under test (EUT) in the antenna‘s path, making it ideal for automotive, military and aerospace BCI EMC testing. It offers the Agilent introduces 2.8-Gb/s Entry-Level Option for Industry‘s Fastest Logic Analyzer Agilent Technologies Inc. introduced a new lower-priced entry-level 1.4-Gb/s state mode option for the industry‘s fastest logic analyzer, the Agilent U4154A. The new option combines a state capture speed of 2.8 Gb/s on 68 channels and 1.4 Gb/sec on 136 channels with scanning at 20 ps and 20 mV resolution, providing reliable capture data on eye openings as small as 160 ps by 160 mV. The Agilent U4154A AXIebased logic analyzer module and associated probes and powerful analysis software provide essential capabilities for engineers working with DDR (double data rate) and low-power DDR memory systems, high-speed application-specific integrated chips, analog-to-digital converters and field-programmable gate arrays operating at speeds up to 4 Gb/s. The industry‘s highest trigger sequencer speeds - 1.4 GHz with Option 01G and 2.5 GHz with Option 02G - give engineers the ability to trigger reliably on sequential events without having to give up triggering flexibility. Being able to validate signal integrity at high speeds becomes critical for reliable performance. The exclusive eye-scan capability of the U4154A gives engineers a quick overview of signal integrity on all signals of a DDR system in a fraction of the time it would take using alternative methods. Identifying problem signals with the U4154A saves time and allows engineers to concentrate their oscilloscope probing on the signals of most concern. Complementing state measurements, timing zoom with 80-ps timing resolution and 256 K-sample memory depth same high reliability and excellent performance as other models in Teseq‘s extensive amplifier line. The GaAs amplifier circuit‘s Class A push pull design ensures linear performance with high reliability and low distortion across the 10 kHz to 400 MHz operating range as well as continued operation at full power even when an open or short circuit is present. For high efficiency, the CBA 400M-110 is powered from a switched mode power supply giving the amplifier a high power factor and a wide voltage operating range. Integral fans cool the unit and an excess temperature sensor prevents faulty cooling. A remote control option is available for this unit. A safety interlock connector is provided, should standby mode be needed. This feature can be activated by a short circuit to ground. In addition, integrated front panel indicators reveal over-temperature and RF interlock conditions. Harmonics are better than -20 dBc at 80 W output. Operating temperature ranges from 0°C to 40 °C (32 °F to 104 °F) and the CBA 400M-110 is covered by a three year parts and labour warranty. ■ TESEQ www.teseq.com gives designers more insight into problems by allowing simultaneous state and highresolution timing measurements over a 20-us time span. The U4154A also offers 2.5- GHz and 5-GHz timing and transitional timing modes in full and half channels respectively. Software and probes for the U4154A logic analyzer help engineers complete their tasks: The U4154A logic analyzer module is compatible with Agilent‘s M9502A two-slot AXIe chassis. Multiple modules can be combined on a single time base and trigger sequencer. Multiple modular systems, including Agilent 16900 Series frames, can be combined for time-correlated measurements on multiple buses in a system. ■ Agilent www.agilent.com News RFMD announces Appointment of Industry Veteran Hans Schwarz as Corporate Vice President, Business Development RF Micro Devices, Inc. announced the appointment of technology veteran Hans Schwarz, age 54, as corporate vice president, business development. Mr. Schwarz brings more than 30 years of technology industry expertise to RFMD as well as wide-ranging involvement in successful business development and M&A activity. In this newly created position, Mr. Schwarz will report to Bob Bruggeworth, president and CEO of RFMD, with responsibility for RFMD‘s corporate business development initiatives, including strategic planning, M&A strategy and execution, and IP-based acquisition and licensing. Mr. Schwarz will be based in RFMD‘s West Coast office, in California‘s Silicon Valley. Before joining RFMD, Mr. Schwarz served as managing director for a 0 million late stage venture capital crossover fund, where he was responsible for searching for and investing in innovative, market-leading late-stage companies in semiconductors, storage, networking and telecom, cleantech, and other industries. Prior to that, Mr. Schwarz spent 15 years at Xilinx, Inc., serving most recently as VP of Business and Strategy Development. Prior to Xilinx, Mr. Schwarz held various management, marketing and engineering positions at Chips and Technologies, Inc.; LSI Logic and Fairchild Semiconductor. Mr. Schwarz holds a BS in Electrical Engineering and Computer Science from Santa Clara University, in Silicon Valley. He is an independent board member of Lattice Semiconductor Corp. ■ RFMD www.rfmd.com hf-praxis 1/2012 41

Fachzeitschriften

1-2-2020
1-2020
5-2019
4-2019
1-2020

hf-praxis

1-2020
12-2019
11-2019
10-2019
9-2019
8-2019
7-2019
6-2019
5-2019
4-2019
3-2019
2-2019
1-2019
EF 2019-2020
Best_Of_2018
12-2018
11-2018
10-2018
9-2018
8-2018
7-2018
6-2018
5-2018
4-2018
3-2018
2-2018
1-2018
EF 2018/2019
12-2017
11-2017
10-2017
9-2017
8-2017
7-2017
6-2017
5-2017
4-2017
3-2017
2-2017
1-2017
EF 2017/2018
12-2016
11-2016
10-2016
9-2016
8-2016
7-2016
6-2016
5-2016
4-2016
3-2016
2-2016
1-2016
2016/2017
12-2015
11-2015
10-2015
9-2015
8-2015
7-2015
6-2015
5-2015
4-2015
3-2015
2-2015
1-2015
12-2014
11-2014
10-2014
9-2014
8-2014
7-2014
6-2014
5-2014
4-2014
2-2014
1-2014
12-2013
11-2013
10-2013
9-2013
8-2013
7-2013
6-2013
5-2013
4-2013
3-2013
2-2013
12-2012
11-2012
10-2012
9-2012
8-2012
7-2012
6-2012
4-2012
3-2012
2-2012
1-2012

PC & Industrie

1-2-2020
EF 2020
12-2019
11-2019
10-2019
9-2019
1-2-2019
8-2019
7-2019
6-2019
5-2019
4-2019
3-2019
EF 2019
EF 2019
12-2018
11-2018
10-2018
9-2018
8-2018
7-2018
6-2018
5-2018
4-2018
3-2018
1-2-2018
EF 2018
EF 2018
12-2017
11-2017
10-2017
9-2017
8-2017
7-2017
6-2017
5-2017
4-2017
3-2017
1-2-2017
EF 2017
EF 2017
11-2016
10-2016
9-2016
8-2016
7-2016
6-2016
5-2016
4-2016
3-2016
2-2016
1-2016
EF 2016
EF 2016
12-2015
11-2015
10-2015
9-2015
8-2015
7-2015
6-2015
5-2015
4-2015
3-2015
2-2015
1-2015
EF 2015
EF 2015
11-2014
9-2014
8-2014
7-2014
6-2014
5-2014
4-2014
3-2014
2-2014
1-2014
EF 2014
12-2013
11-2013
10-2013
9-2013
8-2013
7-2013
6-2013
5-2013
4-2013
3-2013
2-2013
1-2013
12-2012
11-2012
10-2012
9-2012
8-2012
7-2012
6-2012
5-2012
4-2012
3-2012
2-2012
1-2012

meditronic-journal

4-2019
3-2019
2-2019
1-2019
5-2018
4-2018
3-2018
2-2018
1-2018
4-2017
3-2017
2-2017
1-2017
4-2016
3-2016
2-2016
1-2016
4-2015
3-2015
2-2015
1-2015
4-2014
3-2014
2-2014
1-2014
4-2013
3-2013
2-2013
1-2013
4-2012
3-2012
2-2012
1-2012

electronic fab

4-2019
3-2019
2-2019
1-2019
4-2018
3-2018
2-2018
1-2018
4-2017
3-2017
2-2017
1-2017
4-2016
3-2016
2-2016
1-2016
4-2015
3-2015
2-2015
1-2015
4-2014
3-2014
2-2014
1-2014
4-2013
3-2013
2-2013
1-2013
4-2012
3-2012
2-2012
1-2012

Haus und Elektronik

1-2020
4-2019
3-2019
2-2019
1-2019
4-2018
3-2018
2-2018
1-2018
4-2017
3-2017
2-2017
1-2017
4-2016
3-2016
2-2016
1-2016
4-2015
3-2015
2-2015
1-2015
4-2014
3-2014
2-2014
1/2014
4-2013
3-2013
2-2013
1-2013
4-2012
3-2012
2-2012
1-2012

Mediadaten

2020 - deutsch
2020 - english
2020 - deutsch
2020 - english
2020 - deutsch
2020 - english
2020 - deutsch
2020 - english
2020 - deutsch
2020 - english
2019 deutsch
2019 english
2019 deutsch
2019 english
2019 deutsch
2019 english
2019 deutsch
2019 english
2019 deutsch
2019 english
© beam-Verlag Dipl.-Ing. Reinhard Birchel