Fachzeitschrift für Elektronik-Produktion - Fertigungstechnik, Materialien und Qualitätsmanagement
Wafer Level UBM Plating
Wafer Level UBM Plating Electroless NiAu/NiPd/NiPdAu • Automatic chemical delivery & drain system • 4 - 12“ Wafers, panels up to 650 x 650 mm • SECS GEM interface; Mask-less process • In-line control of temperature, pH & flow • Low cost, high reliable metal interface ENIG UBM & ENEPIG OPM • Fully automatic, dry-in dry-out • CN/CN-free chemical options Clip attach www.pactech.de ISO 9001 IATF 16949 ISO 14001 ISO 50001
