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5-2013

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HF-Praxis 5/2013

Test & Measurement

Test & Measurement Agilent Introduces Wireless Communications Test Set with Integrated Multiport Adapter for Manufacturing Test Agilent Technologies Inc. introduced its new E6607C EXT wireless communications test set, featuring an integrated multiport adapter for cost-effective, high-volume wireless device manufacturing test. Optimized for testing multiple devices simultaneously, the EXT-C with integrated multiport adapter enables up to 3x gain in effective test throughput (vs. the EXT-B) for less than 1.3x the price. Smartphone and tablet volumes continue to grow, and test plans continue to expand to accommodate multiple radios, formats and frequency bands in today‘s complex wireless devices. The Agilent EXT-C uniquely addresses these test challenges by increasing test throughput while keeping the overall cost of test equipment affordable and reducing the space and power used on the manufacturing line. The EXT-C is an integrated onebox tester that includes a vector signal analyzer, vector signal generator, high-speed sequence analyzer, eight bi-directional input/output ports for multiformat cellular testing, and four output ports for GNSS testing. Optimized for the fast-sequenced nonsignaling test methods required by the latest wirelessmodem chipsets, the advanced EXT-C sequence analyzer works in synchronization with the modem chipset to eliminate signaling overhead and enable multiple measurements from a single acquisition. Combined with fully calibrated multi-DUT test capabilities, the EXT-C helps manufacturers achieve faster tests and increase yield on the production line. To minimize change in test processes and streamline the transition from R&D to volume manufacturing, the EXT-C uses the extensive X-Series measurement science available on Agilent spectrum analyzers to deliver trusted measurement applications tailored for fast manufacturing test. The EXT-C can be configured with a variety of X-Series measurement applications for cellular communications, wireless connectivity and digital audio/video, with support for standards such as LTE FDD, LTE TDD, TD- SCDMA and 2G/3G. Individual X-Series measurement applications can be included with the original instrument purchase or added later. ■ Agilent www.agilent.com AR’s Versatile 350 Watt Model 350AH1 Amplifier Serves a Variety of Applications in the 10 Hz - 1 MHz Frequency Range AR RF/Microwave Instrumentation has introduced the Model 350AH1 solid state amplifier. This portable, self-contained, 350 watt/10 Hz - 1 MHz unit provides power, durability and dependability along with the versatility for a wide range of applications. Designed for test and other laboratory applications where instantaneous bandwidth, high gain and moderate power output are required, the potential uses for Model 350AH1 are many and varied. When configured for IEC 61000-4-16 testing, the 350AH1 functions as the RF section of the test setup, making it ideal for test levels 1 through 4, for Continuous Disturbance testing; and levels 1 through 3 for Short Duration Disturbance. In addition, the 350AH1 may be used to perform magnetic susceptibility testing defined by CS114 (4 kHz to 1 MHz range) of MIL- STD-461F, antenna and component testing, watt-meter calibration, or as a driver for higher power amplifiers. The unit has both over current and overvoltage protection to avoid damage. The RISC microprocessor controller board provides IEEE-488 (GPIB), USB, Ethernet and asynchronous full duplex RS-232 communication control of all amplifier functions. Two 350AH1 amplifiers may be used together in a bridged output configuration by supplying the same signal to both amplifiers and using the internal signal inversion feature of one amplifier. The amplifier output grounds are connected and the load is placed across the two amplifier outputs. ■ AR RF/Microwave Instrumentation www.arworld.us 44 hf-praxis 5/2013

RF & Wireless Products RFMW Introduces Low Insertion Loss Switch RFMW Ltd. announces design and sales support for the RFSW1012 from RFMD. This SPDT switch operates from 5 MHz to 6 GHz in both 50 ohm and 75 ohm environments. Offering low insertion loss of 0.3 dB with isolation of 37 dB, the RFSW1012 serves multiple applications including LTE, WCDMA, CATV and SATV and is offered in a compact 2 mm x 2 mm x 0.55 mm package. Amazingly, this small package handles up to 4 watts of RF power (>500 MHz ) with suitable heat sinking. No external capacitors are required on RF paths making this switch very easy to integrate. ■ RFMW, Ltd. www.rfmw.com Antenna-in-Package for 60 GHz Hittite Microwave Corporation has launched a highly integrated Antenna-in-Package (AiP) Silicon Transceiver Chipset Solution, which is fabricated with silicon germanium (SiGe) BiCMOS semiconductor process technology and targets 60 GHz applications. The HMC6000LP711E AiP solution combines a 60 GHz antenna with the HMC6000 transmitter IC while the HMC6001LP711E AiP solution combines a 60 GHz antenna with the HMC6001 receiver IC. Both transceivers are available in 7 x 11 mm QFN plastic packages. The chipset not only solves many of the key technical challenges encountered at millimeterwave frequencies, but also enables turn-key multi-Gbps communication links at 60 GHz. Lower frequency baseband signals are directly translated to and from 60 GHz. The HMC6000LP711E AiP Transmitter IC and the HMC6001LP711E AiP Receiver IC provide an integrated frequency synthesizer for tuning across the 57 to 64 GHz band using 500 or 540 MHz steps depending on the reference input frequency. Both devices provide a simple four-wire digital serial interface for full control and status reporting for these ICs, including frequency channel selection, gain control, circuit bias and filter bandwidths. To facilitate evaluation of these 60 GHz Transceiver ICs, Hittite offers the EKIT01- HMC6450 , a complete 60 GHz AiP Transceiver Evaluation Kit containing both the HMC6000LP711E Transmitter and the HMC6001LP711E Receiver. The EKIT01- HMC6450 is the quickest way to get 60 GHz up and running in a lab environment. ■ Hittite Microwave Corporation www.hittite.com Hittite Launches New Groundbreaking Wideband Quantizer Solution Hittite Microwave Corporation has introduced a complete Multi-GHz Quantizer chip set that enables quantization of ultra wideband signals from DC to 18 GHz with excellent linearity and low noise. This Multi-GHz Quantizer solution can facilitate unparalleled levels of performance in test and measurement systems, Bit Error Rate Testers and Pulse Detection Systems including Pulse Doppler Radars where wideband sampling capability is a necessity. The HMC9000 Multi-GHz Quantizer chip set includes an 8-bit 1000 MSPS ADC and a high performance Track-and-Hold- amplifier which offers precision signal sampling over 18 GHz of input bandwidth. This combination of ADC and T/H delivers high linearity of >50 dB SFDR up to 7 GHz and low noise of >40 dB SNR up to 9 GHz at 1 Vp-p full scale level. To enable rapid prototyping of the Multi- GHz Quantizer, Hittite offers both the EVAL01-HMC9000 and the EKIT01- HMC9000 evaluation platforms. Data sheets are available on-line at www.hittite.com. ■ Hittite Microwave Corporation www.hittite.com Software AWR Releases V10.04 – New Upgrade to the AWR Design Environment Ships in 2013 AWR Corporation, the innovation leader in high-frequency EDA software, has announced AWR Design Environment V10.04, its first new software release in 2013, which includes many new features and enhancements to Microwave Office/Analog Office circuit design software and Visual System Simulator (VSS) system design software, as well as AXIEM 3D planar electromagnetic (EM) software and Analyst 3D finite element method (FEM) EM software. A select subset of new features and enhancements in AWR V10.04 include: Microwave Office/Analog Office Environment • New MMIC Getting Started Guide • New SDELTAM measurement • Enhancements to optimization algorithms and yield analyses • Expanded output file support across circuit simulators • New scripts to reset the origins for layout Analyst 3D FEM EM Technology • Up to 80 percent reduction in simulation time • Up to 85 percent reduction in memory usage • Improved error reporting and status update messaging • Meshing and port type enhancements AXIEM 3D Planar EM Technology • Asynchronous simulation enhancements • Improved dataset management • New solver-suitability algorithms • Meshing and port type enhancements Visual System Simulator Environment • Additional yield measurements and RF Budget Analysis measurements • New frequency planning wizard • VSS radar block enhancement/licensing option A full list of the more than 120 “What’s New” items in AWR V10.04 can be found within the software’s online documentation. ■ AWR Corporation www.awrcorp.com hf-praxis 5/2013 45

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meditronic-journal

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electronic fab

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