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Fachzeitschrift für Hochfrequenz- und Mikrowellentechnik

HF- und Mikrowellen

HF- und Mikrowellen Filter Made in Germany Ausführliche Informationen und Preise zu ausgewählten Beispielen finden Sie auf unserer Webseite: wainwright-filters.com/de Für ein individuelles Angebot kontaktieren Sie uns bitte. Aus Forschung und Technik Imec demonstrates 896Gb/s silicon photonics transceiver ISO 9001 ISO 14001 OHSAS 18001 Tiefpass Chebyshev Tiefpass Cauer (elliptisch) Mikrowellen- Tiefpass Stoppband ≤ 30 GHz Fco zwischen 1 GHz und 28 GHz Hochpass Chebyshev Hochpass Cauer (elliptisch) Mikrowellen- Hochpass Passband ≤ 26.5 GHz Fco zwischen 500 MHz und 11.5 GHz Bandsperrfilter L/C Design Cavity Design zwischen 100 MHz und 15 GHz Festfrequenz oder einstellbar, auch computergesteuert Notch Filter Cavity Design Festfrequenz oder einstellbar, auch computergesteuert Notchbreiten ≥ 50 kHz Bandpassfilter Cavity Design Helical Design L/C Design Hoch/Tief Kombination auch im Mikrowellenbereich bis 30 GHz Weitband Schmalband Festfrequenz oder einstellbar, auch computergesteuert Diplexer und Triplexer Cavity Design L/C Design PIM-Testing available Wainwright Instruments GmbH Graf-Rasso-Str. 1 82346 Andechs Tel.: 08152-918230 Fax: 08152-918255 E-Mail: info@wainwright-filters.com Web: www.wainwright-filters.com/de Figure 1: PROFA attached to the GeSi SDM transceiver chip At the OFC 2017, the largest global conference and exposition for optical communications, imec presented a 896 Gb/s silicon photonics transceiver of just a few mm 2 , targeting future Tb/s optical links. This achievement highlights the scalability of imec’s iSiPP50G silicon photonics platform, paving the way for nextgeneration short-reach optical interconnects. Imec www.imec-int.com Figure 2: 56 Gb/s NRZ eye diagrams at 1565 nm for the 16x GeSi EAM transmitter array Driven by exponential demand for interconnect bandwidth in datacenters, single-mode optical transceivers will need to scale to Tb/s capacity and be tightly integrated with network switches. Silicon photonics (SiPh) has been identified as a promising technology platform to realize such aggressive bandwidth and integration targets, substantially going beyond 100 Gb/s technology available today. In the work presented at OFC, imec combines recently developed 50-GHz active optical components with a multi-core fiber interface to showcase a proof-of-concept 896 Gb/s spatial-division multiplexing SiPh transceiver. The bi-directional 896 Gb/s silicon photonics transceiver combines dense arrays of 56 Gb/s Germanium-Silicon (GeSi) electro-absorption modulators and GeSi waveguide photodetectors with a multi-core fiber interface. It comprises arrays of 16 GeSi electro-absorption modulators (EAM) and 16 GeSi photodetectors (PD), implemented with 100 µm channel pitch on a single silicon chip. Both the EAM and PD devices are realized in a single GeSi epitaxial growth step, allowing a simple fabrication scheme. The chip cointegrates optical power splitters to feed a single laser source to the transmitter channels, and a dense array of fiber grating couplers to interface with a pitch reducing optical fiber array (PROFA), provided and packaged by Chiral Photonics. The GeSi EAM and PD components are available for evaluation by companies and academia through imec’s silicon photonics prototyping service and the iSiPP50G multi-project wafer (MPW) service provided by Europractice. The iSiPP50G platform includes a validated passive and active device library and is supported by photonic design software solutions from multiple EDA vendors, including Synopsys, Luceda Photonics and Lumerical, in current or upcoming releases. The Europractice MPW services target datacom, telecom and sensing industries, photonic ASIC ecosystems and academia in the mentioned fields. In 2017, new MPW runs are available at four fixed tape-in dates. First closing date for registering to iSiPP50G technologies is May 5, 2017. PROFAs and full optoelectronic packaging services are available from Chiral Photonics (OFC Booth 3714). ◄ 6 hf-praxis 6/2017

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