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6-2017

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Fachzeitschrift für Hochfrequenz- und Mikrowellentechnik

RF & Wireless Radar and

RF & Wireless Radar and Phased Array VSS’s phased-array block UI enables easy setup for different array configurations and “first cut” analysis of array gain patterns. V13 Highlights • Multiple and variable pulse repetition frequency radar sources • Antenna/phased-array blocks support signal direction • RF links characterization for array elements – Gain, P1dB, NF, sensitivity (S) • Enhanced modeling of element patterns, including mutual coupling • Support for automotive radar, 802.11p (car-to-car) EM Simulation and Modeling The AXIEM and Analyst electromagnetic (EM) simulators within NI AWR Design Environment use Maxwell’s equations to compute the electrical behavior of a structure from its physical geometry. AXIEM provides responses for 3D planar structures such as transmission lines, spiral inductors, and metalinsulator-metal (MIM) capacitors, whereas Analyst addresses 3D objects such as wire bonds, ball grids, finite substrates, and 3D horn antennas. Improvements to AXIEM and Analyst in V13 focus on solver speed and accuracy, as well as features that support greater automation and design flow integration with Microwave Office. AXIEM V13 simulations using the iterative matrix solver are now faster due to the simultaneous solution of multiple ports (right-hand sides), benefiting structures with large port counts the most. The AXIEM advanced frequency sweep (AFS) algorithm automatically selects a set of frequency points to simulate, then uses these simulated points to interpolate the S-parameter response for the entire band. In V13, AFS is now faster and more accurate, and generally converges on a solution with fewer frequency points. Like AXIEM, Analyst V13 offers up to a 50 percent reduction in simulation run times. Major meshing upgrades improve robustness and speed and there is now easier access to the “Ports Only” solve to access port fields, propagation constants, and port impedances. Analyst is now able to model the effects of surface roughness when a roughness parameter is specified, improving the accuracy of transmission line simulations, where surface roughness impacts electrical behavior, such as insertion loss. In addition, Analyzer now offers approximate open and spherically perfectly-matched layer (PML) boundary conditions, which can result in faster simulations for antenna far-field calculations, because the spherical extrusion typically adds fewer elements to the mesh than it would in the rectangular case. Analyst V13 also introduces new 3 D editor functionality and improvements targeting drawing (sketcher) functions and solid object controls, materials and attributes organization in the browser tree, autocomplete for parameter and variable expression, and variable grouping and sorting, to highlight a select few. Third - Party EM Tools The AWR Connected program enables the automated flow of layout data from NI AWR Design Environment into partner simulators. Supported partners include ANSYS HFSS, Sonnet, and CST. In V13, AWR Connected for third-party EM simulators is now more robust and fully bi-directional. After the layout is created in the Microwave Office layout editor, third-party EM tools can be selected as the EM simulator and the resulting dataset is automatically imported back into Microwave Office to tune, optimize, perform yield analysis, and verify results. Physical Design and Layout At RF and microwave frequencies, electrical performance is directly influenced by physical design. Therefore, great care must be taken to ensure that a component’s physical attributes are fully incorporated into the simulation model and that the physical details used in simulation are fully and accurately replicated by the manufacturing process. V13 offers new and improved features that impact design layout and interoperability between NI AWR Design Environment and third-party IC and PCB electronic design automation tools. PCB Data Files The PCB import wizard in V13 makes importing large amounts of complex board data easier and more efficient. V13 now supports the import of IPC-2581 (A and B) and ODB++ (V7 and V8) files that are produced by most enterprise board tools, including Cadence Allegro, Mentor Graphics, Zuken, and more. Importing these files produces a schematic layout representing the board geometry along with a STACKUP element defining the board cross-section. This new capability is intended for importing PCB designs and preparing them for EM simulation with AXIEM and/or Analyst. Once layout geometries are either imported or drawn directly into the design environment layout editor, several new capabilities help designers set up the entire structure or portions of the design for characterization through EM simulation. General shape modifiers – sometimes known as defeaturing - transform the layout for faster, more robust EM simulation to study product data. The shape preprocessor modifier uses a set of rules to specify the types of editing operations to perform on the shapes of each layer and on shapes between layers. The modifier extends the advantages of EM geometry simplification rules to schematic layout and provides a clean and flexible method for applying layerbased shape editing operations in layout. A new line types pane has been added to the layout manager, offering a fast method for simultaneously drawing line-type shapes with all the layers and layer offsets associated with specific MMIC/PCB process technologies commonly used in multi-metal STACKUPS as defined in the line-type definition in the LPF. The layout editor offers several new edit layout commands, including a two-point move and copy with reference command, an expanded rotate submenu supporting rotate, rotate right, and rotate left commands, and auto-repeat. Conclusion NI AWR Design Environment V13 provides new, innovative solutions in design automation and simulation technology for the advancement of high-frequency electronic products serving the communication and aerospace/defense industries. As component requirements for these applications drive advances in semiconductor, PCB, and MCM integration, NI AWR software offers powerful enhancements in design flow automation and greater speed and accuracy for its circuit/system/EM simulation technologies, enabling device manufacturers and system integrators to meet challenging performance metrics, size, cost, and time-to-market goals. For more detail on NI AWR Design Environment V13 visit awrcorp.com/whatsnew which provides documentation covering the hundred plus enhancements/additions to this latest release. ◄ 62 hf-praxis 6/2017

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