Fachzeitschrift für Elektronik-Produktion - Fertigungstechnik, Materialien und Qualitätsmanagement
WE MANUFACTURE EQUIPMENT
WE MANUFACTURE EQUIPMENT FOR YOUR NEEDS www.pactech.com SOLDER BALL PLACEMENT & LASER SOLDERING 3D-Soldering Solder Stacking Wire Soldering BGA Soldering Pre-Soldering of SMD Connector Elements Lid Sealing for Connectors & IR-Sensors Flex to Chip Soldering Through Hole Soldering LASER ASSISTED BONDING (LAB, LCB, LAR) 3D Multi Layer Stacked Packaging Optoelectronic Device Assembly CPU on Interposer Assembly SMD Capacitor Assembly SOLDER REWORK & CHIP REPAIR BGA Rework Interconnects of Camera Module BGA Package Assembly onto Substrate Flex to Flex Seperation
