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7-2017

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Fachzeitschrift für Hochfrequenz- und Mikrowellentechnik

RF & Wireless Products

RF & Wireless Products RF Power Amplifier Module with Field-replaceable Connectors Cryogenic Passive Attenuator (low thermal coefficient of attenuation - TCA). XMA utilizes a film for its cryogenic attenuators of a proprietary alloy that resulted from several years of research performed at Omni Spectra that resulted in the alloy we continue to use today. Our devices often approach Class III levels (MIL-DTL-3033) even at cryogenic temperatures. Richardson RFPD, Inc. announced the availability and full design support capabilities for a new ultrawideband power amplifier module from Analog Devices, Inc. The HMC- C582 is a GaAs MMIC pHEMT power amplifier in a miniature, hermetic module with replaceable SMA connectors that operates between 0.01 and 20 GHz. The device typically provides 24 dB of gain, up to 36 dBm output IP3, and up to 26 dBm of output power at 1 dB gain compression. Inputs/outputs (I/ Os) are internally matched to 50 ohms and are DC blocked. Integrated voltage regulators allow flexible biasing and sequencing control for robust operation. Excellent gain flatness across the operating frequency range makes the new amplifier module ideal for electronic warfare (EW), electronic countermeasures (ECM), radar, fiber optic, and test equipment applications. According to ADI, additional key features of the HMC-C582 includes: • Single 15 V supply • Gain flatness: ±1.5 dB (@ 2...20 GHz) • Dimensions: 1.75” x 1.62” x 0.525” • Packaging: Hermetic ML-4-1 ■ Richardson RFPD, Inc. www.richardsonrfpd. com Many of the Fixed Attenuators now being sold are not stable at cryogenic temperatures. XMA provides several Cryogenic Compatible, Coaxial Fixed Attenuators. These items are being sought after by many prestigious colleges and universities around the word such as Harvard, MIT and Yale. Many universities and colleges performing research on microwave designs/products requiring signal attenuation or termination. The resistive circuit materials are well suited Nordic Semiconductors Bluetooth 5 ready SoC nRF52840 packs a huge performance punch and is especially suited to smart home and advanced wearables applications, including wearables for payments and medical, as well as industrial sensor and other Internet of Things (IoT) devices. The low energy nRF52840 System-on-Chip raises the bar for Nordic’s highend nRF52 series SoC lineup in terms of both performance and feature improvements. Capabilities include support for new long with Low TCR/TCA and will not super-conduct when exposed to temperatures near zero Kelvin. The resistor film and conductors to ceramic adhesion needs to be superior to not fracture with the severe material contractions expansion over the more than 300 degree ranges it will be subjected to. The circuit design needs to have stable attenuation by having all resistors vary in resistance equally during the temperature changes to maintain stable attenuation range and high throughput features of the soon-to-be-released Bluetooth 5 specification, plus radio support for IEEE 802.15.4, more extensive Flash and RAM memory availability, and a new radio hardware architecture with increased output power and link budget. The nRF52840 is designed to support the latest Bluetooth wireless technology Core Specification, Bluetooth 5, that will shortly be officially adopted by the Bluetooth Special Interest Group (SIG). Bluetooth 5 introduces longer range and throughput improvements that significantly enhance Bluetooth wireless technology’s suitability for smart home, wearables, and IoT applications. Compliance with the specification, coupled with increased maximum output The extreme Temperature Coefficient of Expansion issues require a rugged design that survives the extreme thermal shocks. The mounting of the attenuator circuit in the housing needs to allow for contraction and expansion while maintaining excellent electrical contact. XMA’s unit has interconnects that allow this to occur seamlessly without “chatter” or noise occurring. The connector captivation must stand up to this environment as well. ■ RFMW, Ltd. info@rfmw.com www.rfmw.com Especially Suited To Smart Home And Advanced Wearables Applications power, enables the nRF52840 SoC to deliver Bluetooth low energy wireless connectivity with up to 4x the range or 2x the raw data bandwidth (2 Mbps) compared with the Bluetooth low energy implementation of Bluetooth 4.2. In addition to Bluetooth 5 support, the nRF52840 SoC includes IEEE 802.15.4 capability. 802.15.4 wireless technology forms the basis of smart home technologies such as ZigBee and Thread (with additional upper layers not defined by the standard). IEEE 802.15.4 can also be employed as a Network Adaptation Layer with 6LoWPAN and standard Internet Protocols. The nRF52840 SoC’s support for 802.15.4 significantly extends the product’s capability as an interoperable foundation tech- 62 hf-praxis 7/2017

RF & Wireless nology for IoT, smart home, or industrial sensor wireless networks using several different wireless technologies. The nRF52840 SoC has been engineered to build on the mature architecture of Nordic Semiconductor’s existing nRF52 Series of SoCs to support complex Bluetooth low energy and other low-power wireless applications that were previously not possible with a single-chip solution. The nRF52840 SoC employs the proven 64 MHz, 32-bit ARM-Cortex M4F processor employed on Nordic’s nRF52832 SoC, plus a CPU with ample generic processing power, Floating Point, and DSP performance, to meet the demands of even the most demanding wireless applications. The nRF52840 SoC’s hardware enhancements - compared with Nordic’s existing nRF52832 SoC- include: • new radio architecture with onchip PA boosting output power considerably, and extending the link budget for ‘whole house’ applications • doubling of Flash memory to 1 MB • quadrupling of RAM memory to 256 kB • support for Bluetooth 5, 802.15.4, ANT, and • proprietary 2.4 GHz wireless technologies • a full speed USB 2.0 controller • a host of new peripherals (many with EasyDMA) • a quad-SPI interface • The nRF52840 can also operate from power supplies above 5 V, such as re-chargeable battery power sources. Designed to address the inherent security challenges that are faced in IoT, the nRF52840 SoC incorporates the ARM-Crypto- Cell-310 cryptographic accelerator offering best-in-class security for Cortex-M based SoCs. Extensive crypto ciphers and key generation and storage options are also available. The introduction of the nRF52840 SoC will be accompanied by the release of the S140 SoftDevice, Nordic’s latest addition to its family of RF protocol software ‘stacks’. The S140 SoftDevice is a Bluetooth 5 compliant software stack with support for the long range and high data throughput features of Bluetooth 5. Nordic will release its S140 SoftDevice and associated nRF5 SDK with support for Bluetooth 5 longer range and high throughput modes upon ratification of the Bluetooth 5 standard in early December. Engineering samples and development kits will be available to order from Nordic’s global distribution network from December 6th. Production variants of the nRF52840 will be available Q4 2017. ■ Nordic Semiconductor www.nordicsemi.com New Low PIM Loads for DAS Applications SWR of 1.25 and a return loss of 19 dB. Nominal impedance is specified as 50 ohms. The loads can be supplied with either 4.3-10 or 7/16 DIN connectors and come in a choice of two models with average input powers of 200 W and 100 W, measuring 221 x 221 x 80 mm and 221 x 100 x 60 mm respectively. ■ Link Microtek, Ltd. www.linkmicrotek.com Multi-Octave 2-way Power Dividers MECA expands its extensive Power Divider line to include a variety of multi-octave 2-Way Wilkinson Power Dividers which are optimized for excellent performance covering; 3.0-5.0 GHz (802-2-4.000-M01), 2.0-8.0 GHz (802-2-5.000) & 8.0-18.0 (802- 2-13.000) with typical spec’s; Isolation 25 dB, VSWR’s 1.25:1, 0.3dB Insertion Loss and Amplitude balance of 0.2 dB. Made in the USA – 36 month warranty. ■ MECA Electronics, Inc. www.e-meca.com Low PIM Bias Tee’s Type N configurations as well as custom. Weatherproof IP67 standard, IP68 available. Made is USA - 36 month warranty. ■ MECA Electronics, Inc. www.e-MECA.com 6-18 GHz Multi-Octave 3-way Power Divider MECA’s Newest 3-Way Wilkinson Power Divider has been optimized for excellent performance covering; 6.0-18.0 (P3S- 12.000) with specifications such as; Isolation of 20 dB Min/25 dB Typical, VSWR 1.4:1 Max, 0.7 dB Max Insertion Loss and Amplitude balance of 0.4 dB Max All in a compact package of 1”:x1.5”x.4” Made in the USA – 36 month warranty. ■ MECA Electronics, Inc. www.e-meca.com 3dB Low PIM Attenuators Link Microtek has introduced a new series of telecommunications frequency band loads whose low PIM (passive intermodulation) characteristics make them particularly suitable for DAS (distributed antenna system) applications. They can also be used in other types of communications system where low PIM is required. Utilising an internal coaxial cable to absorb microwave power, the LYNX series of loads feature a passive intermodulation distortion of less than -160 dBc over their entire operating frequency range of 698 to 3500 MHz, together with a Low PIM (-140 dBc Typical), High power (7 amp), Bias Tees for DAS Applications, with rugged construction and excellent performance across all wireless bands from 0.698 – 2.700 GHz make them ideal for in-building or tower top systems. Available in various MECA also offers Low PIM 3 dB Attenuators in both 50 & 100 watt models with a Typical PIM spec of -161 dBc. Featuring, a variety of connector styles and configuration within series and between series configurations in; 4.1/9.5, 7/16 & Type N as well as 4.3/10.0 DIN connectors. While handling full rated power to +85 °C. All of the terminations operate cover.698 – 2.700 GHz frequency bands, VSWR = 1.10:1 Typ./1.20:1 Min. Made in USA and 36-month warranty. ■ MECA Electronics, Inc. www.e-MECA.com hf-praxis 7/2017 63

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